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Area array packaging processes : for BGA, Flip Chip, and CSP
Area array packaging processes : for BGA, Flip Chip, and CSP
상세정보
- 자료유형
-
단행본
- ISBN
- 0071428291
- KDC
- 569-4
- 청구기호
- 569 G476a
- 저자명
- Gilleo, Ken
- 서명/저자
- Area array packaging processes : for BGA, Flip Chip, and CSP / edited by Ken Gilleo
- 발행사항
- New Pork : McGraw-Hill, 2004
- 형태사항
- x, 260 p : ill ; 25cm
- 서지주기
- Includes index: p.253-260
- 가격
- US 29.50
- Control Number
- hycl:59299
MARC
008040128s2004 us a 001a eng■020 ▼a0071428291
■035 ▼aKRIC09170231
■040 ▼a211063 ▼d211063
■056 ▼a569▼24
■090 ▼a569 ▼bG476a
■1001 ▼aGilleo, Ken
■24500▼aArea array packaging processes▼bfor BGA, Flip Chip, and CSP▼dedited by Ken Gilleo
■260 ▼aNew Pork▼bMcGraw-Hill▼c2004
■300 ▼ax, 260 p▼bill▼c25cm
■504 ▼aIncludes index: p.253-260
■650 0▼aMicroelectronic packaging
■650 0▼aMultichip modules (Microelectronics)
■9500 ▼bUS▼129.50
■990 ▼a조은미▼b조은미
